Associate Professor
PhD (1994) Purdue University
Room: EB-S10
Phone
(607) 777-3415
FAX: (607) 777-4620
E-mail: sbpark@binghamton.edu
Web: Research
Focus
Teaching
/ Research Focus: Strength of Materials , Mechanics of Composite Materials
, Fracture Mechanics , Finite Element Analysis I and II . Physical reliability
of small-scale systems such as MEMS and sensors , Advanced packaging solution
in 3-D packaging and Pb-free solders , Optomechanics in micro scale deformation
analysis , Reliability of structural failure.
Dr. Park started his academic career at Binghamton University in 2002. He has been involved in several projects related to the electronic packaging in co-operation with Integrated Electronics Engineering Consortium (IEEC) which has broad band of industry as members. His expertise in micro/nano mechanics and optomechanics contributed to the consortium in conducting on-going and prospective projects.
Dr. Park
began his professional career at IBM Microelectronics Division where he
conducted numerous analysis to put the products out on time. Later he
was engaged in the reliability engineering responsible for the reliability
of flip chip technology and high performance packaging. Dr. Park served
as a panelist of Yield Learning Conference hosted by IBM Academy of Technology.
Dr. Park spent over 6 years at IBM Microelectronics Division in Endicott
and East Fishkill, New York.