Optical Measurment Techniques

In plane measurement Technique

1) Aramis 3D Image Correlation

2) Moiré Interferometry

Out of plane measurment Technique

1) Aramis 3D Image Correlation

2) Shadow Moiré Interferometry

3) Twyman-Green Interferometry

4) Far Infrared Fizeau - FIFI

Fabrication of Diffraction Grating

Numerical Techniques

1) 2D and 3D Analysis

• Use of Symmetry: Quarter and Octant
• Simplified geometry
• Verify model with measurements to establish a correlation
• Parametric studies: Effect of geometry on material properties and environmental changes

2) Warpage/CTE Prediction

• Predictions within 5% of measured values
• Determination of unknown material properties

3) Solder Fatigue Life Predictions

• Assume plane strain for 2D analysis
• Define trends in trade off studies
• More detailed model for 3D analysis

4) Life Cycle Tests

• Power Cycling (PC)
• Accelerated Thermal Cycling (ATC)

MicroFabrication

1) Test Strutures for Electromigration of chips.

• Two structures were fabricated on a silicon base: Test structure one was used to find the time to failure for the first level interconnect under the influence of intermetallics and Test structure two was fabricated to find the time to failure without the influence of intermetallics. The time to faliure was found using Black's Equation.

2)Calibration Blocks for Aramis 3D Image Correlation for MEMS devices.

• Calibration Blocks of 2mm, 3mm and 5 mm were fabricated for the Aramis 3D Image Correlation for MEMS appications.