Numerical Technique's

Life cycle Tests

(a)

• Power Cycling (PC)
• Accelerated Thermal Cycling (ATC)

(b)

Difference

(c)

Approach

(d)

Temperature contour plot of Flip Chip PBGA package generating heat of 3W using ICEPACK©

(e)

Finite Element Analysis

(f)

Temp. Distribution of Flip Chip PBGA quarter symmetry model using ANSYS ©

(g)

Temperature Plots

• 1 = Center point on Die
• 2 = Positioned on Substrate
• 3 = on FR4 closer to Substrate
• 4 = on FR4 away from Substrate

Temperature Distribution Across Flip Chip PBGA Package Using ANSYS © Software

(h) Deformation Curves:

Power cycling Deformation curve using ANSYS©

Accelerated Thermal Cycling Deformation curve using ANSYS©