Optical Measuring Technique

3D Image Corelation - Aramis

• Both in-plane and out-of-plane (warpage) deformation measurement capability
• In-situ measurement (in thermal chamber)
• Full field measurement
• Larger field of view (> 1ft)
• Currently limited to 5mm field of view
• Capable of measurement for part with different plateaus
• Curved surface measurement possible (Biomechanics)
• Portable compact system.

(1)

Component Warpage during the reflow process.

(2)

On the top is shown the image of the part and bottom is shown a contour overlapped on top of Aramis image of the same part.

Plot of absolute warpage along the two diagonals of a 35mm BGA package.

(3)

Board warpage due to holding at the edges.